NONDESTRUCTIVE INSPECTION SYSTEMS
HOT TOPICS
FIND PRODUCTS
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TOSCANER-24500twin/AV
TOSCANER-34500FDHigh Energy CT Scanner
Tube voltage: 450 kV
Focal spot: 0.4 mm / 1 mmApplications
Large aluminum die castings
Iron
Castings
Cylinders, tires, and engine blocks -
TXS-33000FD/32300FDMicro-CT scanners
Tube voltages: 300 kV / 230 kV
Focal spot: 4 μmApplications
Small electronic components Chip mounted boards Aluminum die castings Batteries Molded components Resins Fibers GFRP, CFRP, and other plastics
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TXS-31300FD/30900FDCompact CT Scanner
Tube voltage: 130kV/90kV
Focal spot: 5μmApplications
Small Electronic Components Moldings Resins Fibers GFRP/CFRP and others
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TXV-S4130FD/S4090FDStandard Model: X-ray Inspection System
Tube voltages: 130 kV / 90 kV
Focal spot: 5 μmApplications
Chip mounted boards BGAs (solder balls) Electronic components Devices Sensors Resins
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TXV-CH4090FDCompact Tilt Model: X-ray Inspection System
Tube voltage: 90 kV
Focal spot: 5 μmApplications
Chip mounted boards
BGAs (solder balls)
Electronic components Devices
Sensors
Resins -
TXP-5150FDX-ray Inspection System
Tube voltage 150kV
Focal spot size: 0.1mmApplications
Aluminum die castings Mechanical components
Electrical components
Resins moldings -
X's-PRO
In-line and off-line operation
Automatic and manual inspectionsApplications
Inspection of aluminum wheels Inspection of engine covers Inspection of power modules Chip mounted boards
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X's-BT
In-line inspection
Applications
Secondary battery (lithium-ion battery)
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High-speed X-ray inspection system
Visualization of high-speed
internal product behaviorApplications
Real-time state observation
Damage process analysis
Drop test etc. -
X's OFFLINE
X-ray inspection system
Manual inspectionApplications
Electrical components Batteries Aluminum die castings Chip mounted boards
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SU
Crystal orientation measuring unit
Applications
Crystal types: Si, GaAs, sapphire, etc. Crystal face orientations: V-notch, orientation flat, cut face
